教育背景
2015.5 – 2016.5，新加坡國(guó)立大學(xué)，電子與計(jì)算機(jī)工程系，訪問(wèn)學(xué)者
2006.9 – 2009.6，中科院半導(dǎo)體所，微電子學(xué)與固體電子學(xué)，工學(xué)博士
2004.9 – 2006.7，華中科技大學(xué)，電子科學(xué)與技術(shù)，理學(xué)碩士
2000.9 – 2004.6，華中科技大學(xué)，光電子科學(xué)與技術(shù)，工學(xué)學(xué)士
工作簡(jiǎn)歷
2009.7-2011.9， 中科院微電子所，助理研究員
2011.10-2018.3，中科院微電子所，副研究員
2018.4-至今 中科院微電子所 研究員
作為負(fù)責(zé)人先后承擔(dān)了國(guó)家自然科學(xué)基金青年/ 面上基金，02專(zhuān)項(xiàng)、03專(zhuān)項(xiàng)、并與華為、中興等項(xiàng)企業(yè)開(kāi)展多項(xiàng)橫向項(xiàng)目的合作研究。
1、Fengman Liu, Binbin Yang，et al., A Surface Mounting Embedded Optical Transceiver with Bi-directional Data Rate of 8 Channels × 10Gbps, Fiber and Integrated Optics, 2014, 33（1-2）: 17-25
2、Yi He, Fengman Liu, et al., Design and implementation of a 700–2600 MHz RF SiP module for micro base station, Microsystem Technology, 2014, 20：2295-2300
3、Yi He, Fengman Liu，et al., Design and Implementation of Two Different RF SiP for Micro Base Station, 2014 IEEE 16th Electronics Packaging Technology Conference, EPTC 2014, 2014.12.3-2014.12.5
4、Huimin He，F(xiàn)engman Liu, et al., Research on Optical Transmitter and Receiver Module Used for High-Speed Interconnection between CPU and Memory, Fiber and Integrated Optics, 2016
5、Peng Wu，F(xiàn)engman Liu, et al., Design and implementation of a rigid-flex RF front-end system-in-package. Microsystem Technology, 2016
6、Huimin He , Fengman Liu, et al.，Design and implementation of a high-coupling and multi-channel optical transceiver with a novel packaging structure，IEEE Transactions on Components, Packaging and Manufacturing Technology, 2156-3950, 2017.
7、Jun Liu，F(xiàn)engman Liu, et al., Design and Verification of Sub-6GHz RoF Transceiver Employing LR4 TOSA and ROSA Packaging Structure，Microwave and Optical Technology Letters, 2018
申請(qǐng)專(zhuān)利40余項(xiàng)，授權(quán)20余項(xiàng)。
人才隊(duì)伍