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  • 姓名： 楊妍
  • 性別： 女
  • 職稱： 研究員
  • 職務(wù)： 
  • 學(xué)歷： 博士
  • 電話： 010-82995876
  • 傳真： 
  • 電子郵件： yyang10@ime.ac.cn
  • 所屬部門： 先導(dǎo)中心
  • 通訊地址： 北京市朝陽區(qū)北土城西路3號(hào)

    簡　　歷：

  • 教育背景： 

    2011年 - 2015年，新加坡南洋理工大學(xué) / 新加坡IME A*Star，博士，微電子學(xué) / 光子學(xué) 

    工作簡歷： 

    2021年3月至今，中科院微電子所，集成電路先導(dǎo)工藝研發(fā)中心，研究員 

    2018年7月-2021年3月，中科院微電子所，集成電路先導(dǎo)工藝研發(fā)中心，副研究員 

    2017年 - 2018年，新加坡南洋理工大學(xué)，Research Fellow  

    2016年 - 2017年，美國Inphi公司，Staff R&D Engineer  

    2015年 - 2016年，美國Inphi公司，Senior R&D Engineer 

     

    社會(huì)任職：

  •  

    研究方向：

  • 硅基光電子集成芯片、2.5D/3D硅基光電子集成 

    承擔(dān)科研項(xiàng)目情況：

  • 1. 國家重點(diǎn)研發(fā)計(jì)劃項(xiàng)目，6xxx萬，主持

    2. 國家自然科學(xué)基金，面上基金, 75.2萬元，主持

    3. xx領(lǐng)域基金，300萬元，主持 

    4. 國家自然科學(xué)基金，重點(diǎn)基金, 100萬元，單位任務(wù)負(fù)責(zé)人

    5. 國家自然科學(xué)基金，青年基金, 27.6萬元，主持  

    6. 中科院人才項(xiàng)目，280萬元，主持 

    7. 中科院所長基金，50萬元，主持 

    8. 領(lǐng)域基金，100萬元，子課題負(fù)責(zé)人

    代表論著：

  • Selected SCI Journal papers：                                                                  
    [1] Fujun Sun, Zhihua Li, Bo Tang, Bin Li, Peng Zhang, Ruonan Liu, Gang Yang, Kai Huang, Zhe Han, Jun Luo, Wenwu Wang, Yan Yang*, “Scalable high Q-factor Fano resonance from air-mode photonic crystal nanobeam cavity,” Nanophotonics, 2023.
    [2] Yun Zheng, Chonghao Zhai, Dajian Liu, Jun Mao, Xiaojiong Chen, Tianxiang Dai, Jieshan Huang, Jueming Bao, Zhaorong Fu, Yeyu Tong, Xuetong Zhou, Yan Yang, Bo Tang, Zhihua Li, Yan Li, Qihuang Gong, Hon Ki Tsang, Daoxin Dai*, Jianwei Wang*, “Multi-chip Multidimensional Quantum Networks with Entanglement Retrievability,” Science, 2023.
    [3] Jueming Bao, Zhaorong Fu, Tanumoy Pramanik, Jun Mao, Yulin Chi, Yingkang Cao, Chonghao Zhai, Yifei Mao, Tianxiang Dai, Xiaojiong Chen, Xinyu Jia, Leshi Zhao, Yun Zheng, Bo Tang, Zhihua Li, Jun Luo, WenwuWang, Yan Yang*, Yingying Peng, Dajian Liu, Daoxin Dai*, Qiongyi He, Alif Laila Muthali, Leif K. Oxenl？we, Caterina Vigliar, Stefano Paesani, Huili Hou, Raffaele Santagati, JoshuaW. Silverstone, Anthony Laing, Mark G. Thompson, Jeremy L. O’Brien, Yunhong Ding*, Qihuang Gong, JianweiWang*, “Very-large-scale Integrated Quantum Graph Photonics,” Nature Photonics, 2023.
    [4] Liangui Deng, Zile Li,* Zhiqiang Guan, Jin Tao, Gongfa Li, Xiaoli Zhu, Qi Dai, Rao Fu, Zhou Zhou, Yan Yang,* Shaohua Yu, and Guoxing Zheng*, “Full Complex-Amplitude Engineering by Orientation-Assisted Bilayer Metasurfaces,” Advanced Optical Materials, 2023, 2203095.
    [5] Kuixian Chen, Zhiqiang Guan, Zile Li, Yan Yang, Zhixue He, Shaohua Yu,* and Guoxing Zheng*, “Computer-Generated Holographic Nanoprinting,” Laser & Photonics Reviews, 2022, 2200448.
    [6] Xiangpeng Ou, Bo Tang, Peng Zhang, Bin Li, Fujun Sun, Ruonan Liu, Kai Huang, Ling Xie, Zhihua Li, and Yan Yang*, “Microring resonator based on polarization multiplexing for simultaneous sensing of refractive index and temperature on silicon platform,” Optics Express, v. 30, n. 14. 2022. 
    [7] Xiangpeng Ou, Bo Tang, Fujun Sun, Peng Zhang, Bin Li, Kai Huang, Ruonan Liu, Ling Xie, Zhihua Li, and Yan Yang*, “Thermo-optically Tunable Slot Waveguide-based Dual Mode-splitting Resonators with Enhanced Sharp Lineshapes,” Optics Express, v. 30, n. 10. 2022. 
    [8] Tianxiang Dai, Yutian Ao, Jueming Bao, Jun Mao, Yulin Chi, Zhaorong Fu, Yiling You, Xiaojiong Chen, Chonghao Zhai, Bo Tang, Yan Yang*, Zhihua Li, Luqi Yuan, Fei Gao, Xiao Lin, Mark G. Thompson, Jeremy L. O’Brien, Yan Li, Xiaoyong Hu*, Qihuang Gong*, and Jianwei Wang*, “Topologically Protected Quantum Entanglement Emitters,” Nature Photonics, 16, 248-257 (2022). 封面文章. 
    [9] Yulin Chi, Jieshan Huang, Zhanchuan Zhang, Jun Mao, Zinan Zhou, Xiaojiong Chen, Chonghao Zhai, Jueming Bao, Tianxiang Dai, Huihong Yuan, Ming Zhang, Daoxin Dai, Bo Tang, Yan Yang, Zhihua Li, Yunhong Ding, Leif K. Oxenl？we, Mark G. Thompson, Jeremy L. O’Brien, Yan Li, Qihuang Gong, and Jianwei Wang*, “A Programmable qudit-based quantum processor,” Nature Communications, 13: 1166 (2022) 
    [10] Jin Tao, Quan You, Zile Li, Ming Luo, Zichen Liu, Ying Qiu, Yan Yang, Yongquan Zeng, Zhixue He, Xi Xiao, Guoxing Zheng, and Shaohua Yu, “Mass-Manufactured Beam-steering Metasurfaces for High-Speed Full-Duplex Optical Wireless-broadcasting Communcations,” Advanced Materials, v. 34, n. 6, 2022. 
    [11] Xiangpeng Ou, Yan Yang*, Fujun Sun, Peng Zhang, Bo Tang, Bin Li, Ruonan Liu, Daoqun Liu, and Zhihua Li, “Wide-range, ultra-compact, and high-sensitivity ring resonator biochemical sensor with CMOS-compatible hybrid plasmonic waveguide,” Optics Express, v. 29, n. 12, 2021.
    [12] Xiangpeng Ou, Yan Yang*, Bo Tang, Donghao Li, Fujun Sun, Peng Zhang, Ruonan Liu, Bin Li, and Zhihua Li, “Low-loss silicon nitride strip-slot mode converter based on MMI,” Optics Express, v. 29, n. 12, 2021.
    [13] Xiaojiong Chen, Yaohao Deng, Shuheng Liu, Tanumoy Pramanik, Jun Mao, Jueming Bao, Chonghao Zhai, Tianxiang Dai, Huihong Yuan, Jiajie Guo, Shao-Ming Fei, Marcus Huber, Bo Tang, Yan Yang*, Zhihua Li, Qiongyi He*, Qihuang Gong* & Jianwei Wang*, “A generalized multipath delayed-choice experiment on a large-scale quantum nanophotonic chip,” Nature Communications, (2021) 12:2712
    [14] Jin Tao, Lin Wu, Yan Yang, Zicheng Liu, Ying Qiu, Guoxing Zheng*, and Shaohua Yu*, “Light Spin Angular Momentum Spatial Mode Converter Based on Dielectric Metasurface,” Journal of Lightwave Technology, v. 39, n.8, 2021.
    [15] Xiaojun Bi, Jian Li, Zhen Gu, Bo Tang, Chaodi Sheng, Yan Yang*, and Qinfen Xu*, “High Sensitivity and Dynamic-Range 25 Gbaud Silicon Receiver Chipset With Current-Controlled DC Adjustment Path and Cube-Shape Ge-on-Si PD,” IEEE TCAS-I, v.67, n.11, 2020.
    [16] Liangui Deng, Juan Deng, Zhiqiang Guan, Jin Tao, Yang Chen, Yan Yang, Daxiao Zhang, Jibo Tang, Zhongyang Li, Zile Li*, Shaohua Yu*, Guoxing Zheng*, Hongxing Xu*, Cheng-Wei Qiu, and Shuang Zhang, “Malus-metasurface-assisted polarization Multiplexing,” Light: Science & Applications (2020) 9:101.
    [17] Juan Deng+, Yan Yang+, Jin Tao, Liangui Deng, Daoqun Liu, Zhiqiang Guan, Gongfa Li, Zile Li*, Shaohua Yu*, Guoxing Zheng*, Zhongyang Li, and Shuang Zhang, “Spatial frequency multiplexed meta-holography and meta-nanoprinting,” ACS NANO, v.13, 2019. (*co first author)
    [18] Lin Wu, Yan Yang, Zichen Liu, Jin Tao*, “Polarization controlled couplings of surface plasmon with asymmetrical nanoslit pairs,” Current Applied Physics, v.19, n.8, 2019.
    [19] Yan Yang*, Xiaonan Hu, Junfeng Song, Qing Fang, Mingbin Yu, Xiaoguang Tu, Guo-Qiang Lo, and Rusli, “Thermo-optically tunable silicon AWG with above 600 GHz channel tunability," IEEE Photonics Technology Letters, vol. 27, no. 22, pp. 2351-2354, 2015. 
    [20] Yan Yang*, Qing Fang, Mingbin Yu, Xiaoguang Tu, Rusli, and Guo-Qiang Lo, “High efficiency Si optical modulator using Cu travelling-wave electrode”, Optics Express, vol. 22, no. 24, pp. 29978-29985, Nov. 2014. 
    [21] Yan Yang*, Mingbin Yu, Rusli, Qing Fang, Junfeng Song, Liang Ding, and Guo-Qiang Lo, “Through-Si-via (TSV) keep-out-zone (KOZ) in SOI photonics interposer: a study of the impact of TSV-induced stress on Si ring resonators," IEEE Photonics Journal, vol. 5, no. 6, p. 2700611, Oct. 2013. 
    Selected International Conference papers and talk：
    [1] Yan Yang*, Mingbin Yu, Rusli, “RF modeling of the 3D electro-photonic integration based on SOI photonic TSV interposer,” IEEE EDSSC 2019, Invited Talk.
    [2] Yan Yang*, Mingbin Yu, Qing Fang, Junfeng Song, Xiaoguang Tu, Guo-Qiang Lo, and Rusli, “3D silicon photonics packaging based on TSV interposer for high density on-board optics module,” in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, Nevada, USA, 31 May – 3 June, 2016.
    [3] Mingbin Yu*, Yan Yang*, Qing Fang, Xiaoguang Tu, Junfeng Song, King-Jien Chui, Rusli, and Guo-Qiang Lo, “3D electro-optical integration based on high-performance Si photonics TSV interposer,” in Optical Fiber Communication Conference (OFC), Anaheim, California, USA, 20-24 March 2016.
    [4] Yan Yang*, Qing Fang, Mingbin Yu, Xiaoguang Tu, Junfeng Song, Rusli and Guoqiang Lo, “High-performance Si photonics interposer featuring RF travelling-wave electrode (TWE) via Cu-BEOL”, in Optical Fiber Communication Conference (OFC), paper Tu2A.6, Los Angeles, California, USA, 22-26 March 2015.

    專利申請(qǐng)：

  • 第一發(fā)明人專利受理： 

    2021： 

    一種電光調(diào)制器，202110796025.7 

    一種光電探測器，202110797165.6 

    一種芯片，202110540846.4 

    一種低功耗熱光器件及其制作方法，202110224733.3 

    一種光學(xué)器件測試結(jié)構(gòu)及其制作方法，202110189580.3 

    一種集成電路，202110181478.9 

    一種波導(dǎo)結(jié)構(gòu)的參數(shù)優(yōu)化方法，202110161344.0 

    一種光器件，202110050446.5 

    2020： 

    Method for manufacturing silicon optical interposer, method for manufacturing three-dimensional structure, method for integrating surface-electrode ion trap and silicon photoelectronic device, integrated structure, and three dimensional structure，SG 11202012334S 

    Method for integrating surface-electrode ion and silicon photoelectronic device, integrated structure, and three dimensional structure，US 17/121,396 

    一種光器件，2020112724156.6  

    一種光器件及其制造方法，202011467514.X 

    一種電光器件及其制造方法，202011460458.7 

    一種電光器件及其制造方法，202011460459.1 

    一種熱光器件及其制造方法，202011460354.6 

    一種熱光器件及其制造方法，202011460359.9 

    一種半導(dǎo)體器件的制造方法及半導(dǎo)體器件，202011232024.1  

    一種銅互連線的制造方法及半導(dǎo)體器件，202011132578.4  

    一種光器件及其制作方法，202011432709.0  

    一種銅再布線層的制造方法、硅光器件及芯片，202011142132.X  

    2019： 

    3D Integration architecture and process of silicon optical addressing and detection of ion qubit，PCT/CN2019/119912 

    一種硅光轉(zhuǎn)接板及三維架構(gòu)的集成方法 201911120086.0  

    一種柵格形銅電極結(jié)構(gòu)及其制備方法 201911149972.6 

    表面電極離子阱與硅光尋址及探測器、及架構(gòu)的集成方法 201911121046.8  

    一種表面電極離子阱與硅光器件的集成結(jié)構(gòu)及三維架構(gòu) 201911120744.6 

    2018： 

    Architecture Of Si Photonics/TSV Interposer And Ion Trapping For Scalable Quantum Computing, Singapore Patent No. 10201800666V  

     

    獲獎(jiǎng)及榮譽(yù)：