教育背景
2003.09-2007.07? 湖南師范大學(xué)? 通信工程? 學(xué)士 ;? ?
2007.09-2010.07? 北京工業(yè)大學(xué) 微電子學(xué)與固體電子學(xué) 工學(xué)碩士? ?
2016.09-2020.01? 中國科學(xué)院大學(xué) 微電子學(xué)與固體電子學(xué) 工學(xué)博士? ?
工作簡歷?
2020.07-至今? ??中科院微電子所?? 副研究員?
2013.10-2020.07? 中科院微電子所?? 助理研究員?
2010.07-2013.10? 中科院微電子所?? 研究實(shí)習(xí)員?
近5年以第一作者身份發(fā)表論文12篇,通信作者身份2篇,代表論著如下:?
[1] Yidan Tang*, Lan Ge, Hang Gu, Yun Bai, Yafei Luo, Chengzhan Li, Xinyu Liu. Degradation in electrothermal characteristics of 4H-SiC junction barrier Schottky diodes under high temperature power cycling stress. Microelectron. Reliab. 102 113451, 2019 .?
[2] Yi-Dan Tang*, Xin-Yu Liu* , Zheng-Dong Zhou, Yun Bai, and Cheng-Zhan Li. Defects and electrical properties in Al-implanted 4H–SiC after activation annealing. Chin. Phys. B. Vol. 28, No. 10 106101, 2019. ?
[3] Yidan Tang*, Shengxu Dong, Yun Bai, Chengyue Yang, Chengzhan Li, Xinyu Liu. Mechanisms and Characteristics of Large-Area High-Current-Density 4H-SiC Trench Junction Barrier Schottky Diodes. Materials Science Forum. Vol. 963, pp 562-566. 2019. ?
[4] Yidan Tang*, Xinyu Liu, Yun Bai, Shengxu Dong, Shaodong Xu. Study of Temperature-dependent Mechanisms and Characteristics of 4H-SiC Junction Barrier Schottky Rectifiers. Materials Science Forum. Vol. 924, pp 589-592. 2018. ?
[5] Yidan Tang*, Xinyu Liu*, Yun Bai, Chengzhan Li, Chengyue Yang. High-Temperature Reliability Analysis of 1200 V/100 A 4H-SiC Junction Barrier Schottky Diodes. Materials Science Forum, Vol. 1004, pp 1004-1009. 2020.以第一、二發(fā)明人或技術(shù)聯(lián)系人,授權(quán)發(fā)明專利19項(xiàng),其中美國3項(xiàng),代表性專利如下:?
[1] 湯益丹 申華軍 白云 李博 周靜濤 劉煥明 楊成樾 劉新宇.,專利“多能離子注入實(shí)現(xiàn)階梯狀摻雜濃度分布的方法”,ZL201110412636.32. (已授權(quán)).?
[2] 湯益丹 申華軍 白云 周靜濤 楊成樾 劉新宇 李誠瞻 劉國友,專利“碳化硅MOSFET器件及其制造方法”,專利號:ZL201510574417.3. (已授權(quán)).?
[3] Yidan TANG* Huajun SHEN Yun BAI et al. “SILICON CARBIDE MOSFET DEVICE AND METHOD FOR MANUFACTURING THE SAME”, PCT/CN2015/089335. US Patent:US 10,680,067. 美國授權(quán)專利.?
[4] Xinyu Liu Yidan TANG* Shengkai Wang et al.“MICROWAVE PLASMA GENERATING DEVICE FOR PLASMA OXIDATION OF SIC”, US Patent :US 10, 734, 199.? 美國授權(quán)專利.?
[5] Xinyu Liu Yidan TANG* Shengkai Wang et al. “METHOD FOR MANUFACTURING GROOVED MOSFET DEVICE BASED ON TWO-STEP MICROWAVE PLASMA OXIDATION”, US Patent: US 10,763,105. 美國授權(quán)專利.2016-2018年中科院微電子所博士榮譽(yù)獎(jiǎng)學(xué)金,特等獎(jiǎng)學(xué)金;?
2018年中科院微電子所“優(yōu)秀個(gè)人”;?
2019年中科院微電子所“科研新星”三等獎(jiǎng);?
2019年北京市科學(xué)技術(shù)發(fā)明二等獎(jiǎng),No.2019-F01-2-02-R09;
人才隊(duì)伍