教育背景:
1998.09-2002.07 北京大學(xué) 計(jì)算機(jī)科學(xué)與技術(shù)系 微電子與固體電子學(xué)專業(yè) 本科
2002.09-2005.07 北京大學(xué) 信息科學(xué)技術(shù)學(xué)院 微電子學(xué)系 碩士
2005.09-2011.07韓國(guó)三星電子 半導(dǎo)體事業(yè)部 高級(jí)工程師/工程師
2011.08-2020.06 中國(guó)科學(xué)院微電子研究所 集成電路先導(dǎo)工藝研發(fā)中心 副研究員
集成電路器件可靠性物理與工藝協(xié)同優(yōu)化
1.校企產(chǎn)研項(xiàng)目,2023.04-2024.10,150萬(wàn),項(xiàng)目負(fù)責(zé)人
2.地方企業(yè)項(xiàng)目,2023.01-2025.12,1438萬(wàn),項(xiàng)目負(fù)責(zé)人
3.高技術(shù)項(xiàng)目,2020.08-2023.08,220萬(wàn),項(xiàng)目負(fù)責(zé)人
1.Hao Chang, Qianqian Liu, Hong Yang* et.al, Effectiveness of Repairing Hot Carrier Degradation in Si p-FinFETs using Gate Induced Drain Leakage, IEEE Electron Device Letters, 2023,44(3): 372-375.
2.Longda Zhou, Qingzhu Zhang, Hong Yang* et.al, Recovery Behavior of Interface Traps after Negative Bias Temperature Instability Stress in p-FinFETs Featuring Fast Trap Characterization Technique, IEEE Transactions on Electrons Devices, vol. 68, No. 9, pp. 4251-4258, Sep. 2021.
3.Longda Zhou, Zhaohao Zhang, Hong Yang* et.al, A Fast DCIV Technique for Characterizing the Generation and Repassivation of Interface Traps Under DC/AC NBTI Stress/Recovery Condition in Si p-FinFETs, in IEEE International Reliability Physics Symposium (IRPS), Monterey, USA, Mar. 2021. (Oral)
4.Hao Chang, Longda Zhou, Hong Yang*, et.al, Comparative Study on the Energy Distribution of Defects under HCD and NBTI in Short Channel p-FinFETs, in IEEE International Reliability Physics Symposium (IRPS), Monterey, USA, Mar. 2021. (Oral)
5.Longda Zhou, Qingzhu Zhang, Hong Yang* et.al, Understanding Frequency Dependence of Trap Generation under AC Negative Bias Temperature Instability Stress in Si p-FinFETs, IEEE Electron Device Letters, pp.965-968, vol.41, issues7, July 2020.
6.Hong Yang, Weichun Luo, Longda Zhou et.al, Impact of ALD TiN Capping Layer on Interface Trap and Channel Hot Carrier Reliability of HKMG nMOSFETs, IEEE Electron Device Letters, p.1129-1132, vol.39, issue 8, Aug. 2018.
已授權(quán)專利:
1.楊紅等,美國(guó)專利,授權(quán)號(hào):US9831089 B2
2.楊紅等,美國(guó)專利,授權(quán)號(hào):US8921171.B2
3.楊紅等,中國(guó)專利,授權(quán)號(hào):ZL201510661889.2
4.楊紅等,中國(guó)專利,授權(quán)號(hào):ZL201310331607.3
5.楊紅等,中國(guó)專利,授權(quán)號(hào):ZL201310160772.7
6.楊紅等,中國(guó)專利,授權(quán)號(hào):ZL201210246582.2
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