最新精品国偷自产在线美女足_国产午夜精华无码网站_天天爱天天做狠狠久久做_国产片免费福利片永久_欧美国产成人精品一区二区三区

教育背景

2017.12-2020.06? 荷蘭代爾夫特理工大學，微電子系，博士

工作簡歷

2021.07-今，中國科學院微電子研究所，系統(tǒng)封裝與集成研發(fā)中心，副研究員

2016.01-2021.06，中國科學院微電子研究所，系統(tǒng)封裝與集成研發(fā)中心，助理研究員；

2012.07-2015.12, 中國科學院微電子研究所, 系統(tǒng)封裝與集成研發(fā)中心, 研究實習員

在TPEL、ATE、TED等學科頂刊和頂會上發(fā)表論文60余篇

[1]?Fengze Hou, Hengyun Zhang, Dezhu Huang, Jiajie Fan, Fengman Liu, Tingyu Lin, Liqiang Cao, Xuejun Fan, Braham Ferreira, G.Q. Zhang, Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm² Heat Dissipation, IEEE Transactions on Power Electronics, 2020, 35(10): 10592-10600.

[2]X. Sun, M. Chen*, B. Li, F Hou*, et al., ”Design and Evaluation of a Face-down Embedded SiC Power Module with Low Parasitic Inductance and Low Thermal Resistance,” IEEE Transactions on Power Electronics, vol. 38, no. 3, pp. 2799-2804, 2023.

[3]?Fengze Hou, Wenbo Wang, Rui Ma, Yonghao Li, Zhonglin Han, Meiying Su, Jun Li, Zhongyao Yu, Yang Song, Qidong Wang, Min Chen, Liqiang Cao, Guoqi Zhang, Braham Ferreira, Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging, IEEE Journal of Emerging and Selected Topics in Power Electronics, 2020, 8(1): 367-380.

[4]?Fengze Hou, Wenbo Wang, Liqiang Cao, Jun Li, Meiying Su, Tingyu Lin, Guoqi Zhang, Braham Ferreira, Review of Packaging Schemes for Power Module, IEEE Journal of Emerging and Selected Topics in Power Electronics, 2020, 8(1): 223-238.

[5]?Yichen Qian, Fengze Hou, Jiajie Fan, Quanya Lv, Xuejun Fan, Guoqi Zhang, Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network, IEEE Transactions on Electron Devices, 2021, 68: 3460-3467.

[6]?Fengze Hou, Wenbo Wang, Tingyu Lin, Liqiang Cao, Guoqi Zhang, J. A. Ferreira, Characterization of PCB Embedded Package Materials for SiC MOSFETs, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9(6): 1054-1061.

[7]?Fengze Hou, Wenbo Wang, Hengyun Zhang, Cheng Chen, Chuan Chen, Tingyu Lin, Liqiang Cao, G.Q. Zhang, J.A. Ferreira, Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages, Applied Thermal Engineering, 2019, 163: 114338.

[8]?Fengze Hou, Tingyu Lin, Liqiang Cao, Fengman Liu, Jun Li, Xuejun Fan, Guoqi Zhang, Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(10): 1721-1728.

[9]?Chuan Chen, Fengze Hou, Rui Ma, Meiying Su, Jun Li, Liqiang Cao, Design, integration and performance analysis of a lid-integral microchannel cooling module for high-power chip, Applied Thermal Engineering, 2021, 198: 117457.

[10]?Fengze Hou, Xueping Guo, Qidong Wang, Wenbo Wang, Tingyu Lin, Liqiang Cao, Guoqi Zhang, J.A. Ferreira, High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology, IEEE Electronic Components and Technology Conference, CA, 2018, pp. 1365- 1370.

[11]?Fengze Hou, Yunyan Zhou, Fengman Liu, Meiying Su, Cheng Chen, Jun Li, Tingyu Lin, Liqiang Cao, Optimization Design of 2.5D TSV Package Using Thermo-electrical Co-simulation Method, IEEE Electronic Components and Technology Conference, Las Vegas, NV, 2016, pp. 1964-1969.

授權24項中國和美國專利

[1]Fengze Hou, Tingyu Lin. Heat dissipation solution for advanced chip packages, US9653378B2.

[2]侯峰澤, 陳釧, 通過微流道散熱的器件封裝結構及其制作方法, CN109119392B.

[3]侯峰澤, 曹立強, 陳釧, 馬瑞, 蘇梅英, 一種半導體器件散熱模塊及電子裝置, CN112768418B.

[4]侯峰澤. 一種制作剛柔結合板的三維封裝散熱結構的方法, CN103594433A.

[5]侯峰澤, 邱德龍. 一種剛柔結合板的三維封裝散熱結構, CN103594432A.

[6]侯峰澤, 蘇梅英, 徐成. 一種基于載體的扇出2.5D/3D封裝結構, CN105428260B.

[7]侯峰澤, 林挺宇. 用于倒裝焊大功率芯片BGA封裝的散熱結構, CN104112726B.

[8]侯峰澤, 林挺宇. 用于大功率邏輯芯片PoP封裝的散熱結構, CN104134637A.

[9]侯峰澤, 林挺宇. 用于大功率芯片BGA封裝的散熱結構, CN104112725B.

[10]侯峰澤, 劉豐滿, 李君.一種用于PoP封裝的散熱結構, CN103560117B.